GENEVA, July 31 -- MICROPOLARIS EQUIPMENT TECHNOLOGY CO., LTD. filed a patent application (CN2025/077737) for “WAFER BAKING CHAMBER AND SEMICONDUCTOR DEVICE”. With publication no. WO/2026/156954, here... और पढ़ें
GENEVA, July 31 -- WUHU INSTITUTE OF TECHNOLOGY filed a patent application (CN2025/076909) for “MOUNTING DEVICE OF UNMANNED AERIAL VEHICLE AND UNMANNED AERIAL VEHICLE”. With publication no. WO/2026/15... और पढ़ें
GENEVA, July 31 -- SONGSHAN LAKE MATERIALS LABORATORY filed a patent application (CN2025/077016) for “FUSED HETEROCYCLIC POLYMER, AND PREPARATION METHOD THEREFOR AND USE THEREOF”. With publication no.... और पढ़ें
GENEVA, July 31 -- DONGGUAN ZHANWEI ELECTRONICE TECHNOLOGY CO., LTD filed a patent application (CN2025/077271) for “AUTOMATIC ENCAPSULATION APPARATUS FOR SEMICONDUCTOR PANELS”. With publication no. WO... और पढ़ें
GENEVA, July 31 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. filed a patent application (CN2025/076508) for “HIGH-RESISTANCE RESIN COMPOSITION FOR STACKED CHIP PACKAGING AND PREPARATION METHOD ... और पढ़ें
GENEVA, July 31 -- ZHEJIANG QUANZHUN INTELLIGENT EQUIPMENT CO., LTD filed a patent application (CN2025/076577) for “METHOD FOR IMPLEMENTING MACHINING CHANNEL COMPENSATION OF MULTI-SPINDLE MACHINE TOOL... और पढ़ें
GENEVA, July 31 -- FUDAN UNIVERSITY filed a patent application (CN2025/076821) for “FULLY-CHEMICALLY SYNTHESIZED RIBONUCLEIC ACID CAPABLE OF BEING TRANSLATED INTO PROTEIN, AND USE THEREOF”. With publi... और पढ़ें
GENEVA, July 31 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. filed a patent application (CN2025/076504) for “HIGH-THERMAL-CONDUCTIVITY EPOXY RESIN COMPOSITION FOR PACKAGING AND PREPARATION METH... और पढ़ें
GENEVA, July 31 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. filed a patent application (CN2025/076505) for “LOW-SHRINKAGE-RATE EPOXY RESIN COMPOSITION AND USE THEREOF IN IPM PACKAGING”. With p... और पढ़ें
GENEVA, July 31 -- SHANGHAI DAOYI SEMICONDUCTOR MATERIALS CO., LTD. filed a patent application (CN2025/076506) for “EPOXY RESIN COMPOSITION AND USE THEREOF IN WIDE-ROW SOT23 PACKAGING”. With publicati... और पढ़ें